1. Assembly reliability improvement of 3D-ICs packaging using pre-stuffed molding material. (August 2015) Authors: Lee, Chang-Chun; Lin, Yu-Min; Guo, Yu-Huan; Zhan, Chau-Jie; Chang, Tao-Chih; Dzeng, Yu-Hua Journal: Vacuum Issue: Volume 118(2015) Page Start: 152 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗