1. Effect of Bonding Time and Bonding Temperature on Lead-Free Solder Joints Dispersed Pillar Shaped IMCs. (2017) Authors: Hayashi, Yawara; Nakata, Yusuke; Shohji, Ikuo; Koyama, Shinji; Hashimoto, Tomihito Journal: Procedia engineering Issue: Volume 184(2017) Page Start: 214 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗