1. Microstructure evolution and growth behavior of Cu/SAC105/Cu joints soldered by thermo-compression bonding. Issue 4 (2nd September 2019) Authors: Guo, Mengjiao; Sun, F.; Yin, Zuozhu Journal: Soldering & surface mount technology Issue: Volume 31:Issue 4(2019) Page Start: 227 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
2. Microstructure evolution and growth behavior of Cu/SAC105/Cu joints soldered by thermo-compression bonding. Issue 4 (13th May 2019) Authors: Guo, Mengjiao; Sun, F.; Yin, Zuozhu Journal: Soldering & surface mount technology Issue: Volume 31:Issue 4(2019) Page Start: 227 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗