1. Electrical characteristics and reliability performance of IGBT power device packaging by chip embedding technology. Issue 12 (December 2015) Authors: Chang, Tao-Chih; Lee, Chang-Chun; Hsieh, Chia-Ping; Hung, Sheng-Che; Cheng, Ren-Shin Journal: Microelectronics and reliability Issue: Volume 55:Issue 12 Part A(2015) Page Start: 2582 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗