1. Effect of high-frequency PCB laminate on thermal cycling behavior of electronic packaging structures. Issue 1 (6th January 2022) Authors: Huang, Lijuan; Zhu, Zhenghu; Wu, Hiarui; Long, Xu Journal: Multidiscipline modeling in materials and structures Issue: Volume 18:Issue 1(2022) Page Start: 111 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗