1. Failure mechanisms of the bonded interface between mold epoxy and metal substrate exposed to high temperature. (1st April 2023) Authors: Zhao, Shuaijie; Chen, Chuantong; Haga, Motoharu; Ueshima, Minoru; Hirahara, Hidetoshi; Sang, Jing; Cho, Sung hun; Sekino, Tohru; Suganuma, Katsuaki Journal: Composites Issue: Number 254(2023) Page Start: Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗