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Subject Electroplating -- Back end process -- SU-8

1. Back plate electroplating for high aspect ratio processes. Issue 2 (2nd May 2017)

Authors:
Marasso, Simone Luigi; Benetto, Simone; Para, Isabella; Ottone, Chiara; Mombello, Domenico; Perrone, Denis; Ferrero, Sergio; Scaltrito, Luciano; Pugliese, Diego; Cocuzza, Matteo; Pirri, Fabrizio Candido
Journal:
Microelectronics international
Issue:
Volume 34:Issue 2(2017)
Page Start:
69
Record Type:
Journal Article
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