1. An observation and explanation of interior cracking at the interface of solder by electromigration. (June 2019) Authors: Wang, Qizhi; Liu, Qingyi; Zhang, Zheng; Miao, Min; Su, Yehao; Su, Fei Journal: Microelectronics and reliability Issue: Volume 97(2019) Page Start: 79 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗