1. Influence of post-bonding heating process on the long-term reliability of Cu/Al contact. (March 2021) Authors: Eto, Motoki; Araki, Noritoshi; Yamada, Takashi; Sugiyama, Masaaki; Fujimoto, Shinji Journal: Microelectronics and reliability Issue: Volume 118(2021) Page Start: Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗