1. Intermetallic size and morphology effects on creep rate of Sn-3Ag-0.5Cu solder. (February 2021) Authors: Xu, Yilun; Gu, Tianhong; Xian, Jingwei; Giuliani, Finn; Ben Britton, T.; Gourlay, Christopher M.; Dunne, Fionn P.E. Journal: International journal of plasticity Issue: Volume 137(2021) Page Start: Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗