1. Copper wire bonding package decapsulation using the anodic protection method. Issue 1 (January 2015) Authors: Endoh, Hirohiko; Naoe, Takuya Journal: Microelectronics and reliability Issue: Volume 55:Issue 1(2015) Page Start: 207 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗