1. Packaging design for improving the uniformity of Chip scale package (CSP) LED luminescence. (July 2021) Authors: Jiang, Nan; Liu, Huizi; Zou, Jun; Guo, Chunfeng; Li, Wenbo; Shi, Mingming; Yang, Bobo; Liu, Yiming; Guo, Bin Journal: Microelectronics and reliability Issue: Volume 122(2021) Page Start: Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗