1. Optimization of cleaning process parameters to remove abrasive particles in post-Cu CMP cleaning *Project supported by the Major National Science and Technology Special Projects (No. 2016ZX02301003-004-007), the Natural Science Foundation of China (No. 61704046), the Scientific Innovation Grant for Excellent Young Scientists of Hebei University of Technology (No. 2015007), and the Hebei Natural Science Foundation Project (No. F2018202174). (December 2018) Authors: Yang, Liu; Tan, Baimei; Liu, Yuling; Gao, Baohong; Han, Chunyu Journal: Journal of semiconductors Issue: Volume 39:Number 12(2018:Dec.) Page Start: Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗