1. Chemical Mechanical Polishing and Planarization of Mn-Based Barrier/Ru Liner Films in Cu Interconnects for Advanced Metallization Nodes. (1st January 2017) Authors: Sagi, K. V.; Teugels, L. G.; van der Veen, M. H.; Struyf, Herbert; Babu, S. V. Journal: ECS journal of solid state science and technology Issue: Volume 6:Number 5(2017) Page Start: P259 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
2. Chemical Mechanical Polishing and Planarization of Mn-Based Barrier/Ru Liner Films in Cu Interconnects for Advanced Metallization Nodes. (30th March 2017) Authors: Sagi, K. V.; Teugels, L. G.; van der Veen, M. H.; Struyf, Herbert; Babu, S. V. Journal: ECS journal of solid state science and technology Issue: Volume 6:Number 5(2017) Page Start: P259 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗