1. The amorphous interphase formed in an intermetallic-free Cu/Sn couple during early stage electromigration. (October 2018) Authors: Liang, Chien-Lung; Lin, Kwang-Lung Journal: Scripta materialia Issue: Number 155(2018) Page Start: 58 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗