1. Effect of nitrogen flow rate on TaN diffusion barrier layer deposited between a Cu layer and a Si-based substrate. Issue 15 (15th October 2017) Authors: Chen, Shih-Fan; Wang, Shea-Jue; Yang, Tzu-Hsien; Yang, Zheng-Da; Bor, Hui-Yun; Wei, Chao-Nan Journal: Ceramics international Issue: Volume 43:Issue 15(2017) Page Start: 12505 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗