1. Numerical study of microbump failure in 3D microelectronic structures. (June 2016) Authors: Shen, Y.-L.; Flores, G.C.; Guthrie, J. Journal: Microelectronics and reliability Issue: Volume 61(2016) Page Start: 48 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗