1. Temporary polymer bonding for the manufacturing of thin wafers: An innovative low temperature process. (1st March 2021) Authors: Montméat, P.; Bally, L.; Dechamp, J.; Enot, T.; Fournel, F. Journal: Materials science in semiconductor processing Issue: Volume 123(2021) Page Start: Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗