1. Investigating stress measurement capabilities of GHz Scanning Acoustic Microscopy for 3D failure analysis. (September 2016) Authors: Khaled, A.; Brand, S.; Kögel, M.; Appenroth, T.; De Wolf, I. Journal: Microelectronics and reliability Issue: Volume 64(2016) Page Start: 336 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
2. Investigating stress measurement capabilities of GHz Scanning Acoustic Microscopy for 3D failure analysis. (September 2016) Authors: Khaled, A.; Brand, S.; Kögel, M.; Appenroth, T.; De Wolf, I. Journal: Microelectronics and reliability Issue: Volume 64(2016) Page Start: 336 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗