Date: 2020 / Journal: Microelectronics and reliability - British Library Electronic Legal Deposit Catalogue-Journal Issues and Articles Search Results

Date 2020 Journal Microelectronics and reliability

1. "Limiting power cycling stress in power MOSFETs by active thermal control". (August 2020)

Authors:: Magnone, Paolo; Abedini, Hossein; Petucco, Andrea
Journal:: Microelectronics and reliability
Issue:: Volume 111(2020)
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Record Type:: Journal Article
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2. 0.5 μm GaN RF power bar technology space evaluation. (November 2020)

Authors:: Van de Casteele, J.; Stuhldreier, H.; Bouw, D.; Gourdon, C.; Raoult, M.; Durand, E.; Van Den Berghe, S.; Hollmer, M.; Grunwald, M.; Lambert, B.; Blanck, H.; Barnes, A.
Journal:: Microelectronics and reliability
Issue:: Volume 114(2020)
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Record Type:: Journal Article
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3. A 3-D thermal network model for the temperature monitoring of thermal grease as interface material. (November 2020)

Authors:: Zhang, Xiaotong; Wang, Shihang; Xin, Lei; Wu, Kangning; Yu, Xiaoling; Wang, Xiaolin; Li, Jianying
Journal:: Microelectronics and reliability
Issue:: Volume 114(2020)
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Record Type:: Journal Article
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4. A comparison study on electromagnetic susceptibility of current reference circuits with scaling-down technologies and schemes. (November 2020)

Authors:: Wang, Zhian; Li, Binhong; Wu, Jianfei; Zhao, Wenxin; Li, Bo; Liu, Hainan; Guan, Chongjie; Feng, Shiwei; Luo, Jiajun; Ye, Tianchun
Journal:: Microelectronics and reliability
Issue:: Volume 114(2020)
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Record Type:: Journal Article
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5. A comprehensive evaluation of radiation hardening by applying negative body bias and back-gate bias in 130 nm PDSOI technology. (February 2020)

Authors:: Xie, Xin; Zhu, Huilong; Bi, Dawei; Hu, Zhiyuan; Ren, JiangChuan; Zhang, Haineng; Zhang, Zhengxuan; Zou, Shichang
Journal:: Microelectronics and reliability
Issue:: Volume 105(2020)
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Record Type:: Journal Article
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6. A comprehensive solution for modeling moisture induced delamination in electronic packaging during solder reflow. (September 2020)

Authors:: Wang, Jing; Niu, Yuling; Shao, Shuai; Wang, Huayan; Xu, Jiefeng; Pham, Vanlai; Park, Seungbae
Journal:: Microelectronics and reliability
Issue:: Volume 112(2020)
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Record Type:: Journal Article
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7. A fault tolerant switched reluctance motor drive for electric vehicles under multi-switches open-fault conditions. (November 2020)

Authors:: Yang, Qingqing; Wang, Rui; Ma, Mingyao; Yang, Shuying; Zhang, Xing
Journal:: Microelectronics and reliability
Issue:: Volume 114(2020)
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Record Type:: Journal Article
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8. A high-efficiency threshold voltage distribution test method based on the reliability of 3D NAND flash memory. (November 2020)

Authors:: Wei, Debao; Chen, Xiaoyu; Feng, Hua; Qiao, Liyan; Peng, Xiyuan
Journal:: Microelectronics and reliability
Issue:: Volume 114(2020)
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Record Type:: Journal Article
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9. A highly stable reliable SRAM cell design for low power applications. (February 2020)

Authors:: Pal, Soumitra; Bose, Subhankar; Ki, Wing-Hung; Islam, Aminul
Journal:: Microelectronics and reliability
Issue:: Volume 105(2020)
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Record Type:: Journal Article
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10. A hybrid system-level prognostics approach with online RUL forecasting for electronics-rich systems with unknown degradation behaviors. (August 2020)

Authors:: Al-Mohamad, Ahmad; Hoblos, Ghaleb; Puig, Vicenç
Journal:: Microelectronics and reliability
Issue:: Volume 111(2020)
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Record Type:: Journal Article
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