1. Experimental and numerical investigations of the vibration reliability of BGA and LGA solder configurations and SAC105 and 63Sn37Pb solder alloys. Issue 2 (1st April 2019) Authors: Gharaibeh, Mohammad; Stewart, Aaron J.; Su, Quang T.; Pitarresi, James M. Journal: Soldering & surface mount technology Issue: Volume 31:Issue 2(2019) Page Start: 77 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗