1. A copper electroplating formula for BVHs and THs filling at one process. Issue 3 (1st August 2016) Authors: liu, jia; chen, jida; Zhang, Zhu; Yang, Jiali; He, Wei; Chen, Shijin Editors: Baoyong, Chi Journal: Circuit world Issue: Volume 42:Issue 3(2016) Page Start: Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗