Author/Creator: Zhong, Su-juan - British Library Electronic Legal Deposit Catalogue-Journal Issues and Articles Search Results

Author/Creator Zhong, Su-juan

1. Cu/SnAgCu/Cu TLP with different thicknesses for 3D IC. Issue 3 (5th June 2017)

Authors:: Zhang, Liang; Liu, Zhi-quan; Yang, Fan; Zhong, Su-juan
Journal:: Soldering & surface mount technology
Issue:: Volume 29:Issue 3(2017)
Page Start:: 151
Record Type:: Journal Article
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2. Development of lead-free interconnection materials in electronic industry during the past decades: Structure and properties. (March 2022)

Authors:: Zhong, Su-juan; Zhang, Liang; Li, Mu-lan; Long, Wei-min; Wang, Feng-jiang
Journal:: Materials & design
Issue:: Volume 215(2022)
Page Start:
Record Type:: Journal Article
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3. Materials modification of the lead-free solders incorporated with micro/nano-sized particles: A review. (1st January 2021)

Authors:: Li, Mu-lan; Zhang, Liang; Jiang, Nan; Zhang, Lei; Zhong, Su-juan
Journal:: Materials & design
Issue:: Volume 197(2021)
Page Start:
Record Type:: Journal Article
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