Author/Creator: Zahedmanesh, H. - British Library Electronic Legal Deposit Catalogue-Journal Issues and Articles Search Results

Author/Creator Zahedmanesh, H.

1. A combined modelling approach to design test structures to study thermomigration in Cu interconnects. (November 2022)

Authors:: Ding, Y.; Lofrano, M.; Varela Pedreira, O.; Zahedmanesh, H.; Croes, K.; De Wolf, I.
Journal:: Microelectronics and reliability
Issue:: Volume 138(2022)
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Record Type:: Journal Article
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2. Analysis of electromigration failure of nano-interconnects through a combination of modeling and experimental methods. (September 2019)

Authors:: Ceric, H.; Zahedmanesh, H.; Croes, K.
Journal:: Microelectronics and reliability
Issue:: Volume 100/101(2019)
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Record Type:: Journal Article
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3. Mechanical stability of airgaps in nano-interconnects. (April 2020)

Authors:: Vanstreels, K.; Zahedmanesh, H.; Gonzalez, M.
Journal:: Microelectronics and reliability
Issue:: Volume 107(2020)
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Record Type:: Journal Article
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4. Review—Modeling Methods for Analysis of Electromigration Degradation in Nano-Interconnects. (4th March 2021)

Authors:: Ceric, H.; Selberherr, S.; Zahedmanesh, H.; de Orio, R. L.; Croes, K.
Journal:: ECS journal of solid state science and technology
Issue:: Volume 10:Number 3(2021)
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Record Type:: Journal Article
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