1. Impact of Pad Material Properties on CMP Performance for Sub-10nm Technologies. (1st January 2019) Authors: Khanna, Aniruddh J.; Kakireddy, Raghava; Jawali, Puneet; Chockalingam, Ashwin; Redfield, Daniel; Bajaj, Rajeev; Fung, Jason; Cornejo, Mario; Yamamura, Mayu; Yuan, Zhibo; Orilall, Chris; Fu, Boyi; Ganapathi, Gana; Redeker, Fred C; Patibandla, Nag B Journal: ECS journal of solid state science and technology Issue: Volume 8:Number 5(2019) Page Start: P3063 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
2. Impact of Pad Material Properties on CMP Performance for Sub-10nm Technologies. (28th February 2019) Authors: Khanna, Aniruddh J.; Kakireddy, Raghava; Jawali, Puneet; Chockalingam, Ashwin; Redfield, Daniel; Bajaj, Rajeev; Fung, Jason; Cornejo, Mario; Yamamura, Mayu; Yuan, Zhibo; Orilall, Chris; Fu, Boyi; Ganapathi, Gana; Redeker, Fred C; Patibandla, Nag B Journal: ECS journal of solid state science and technology Issue: Volume 8:Number 5(2019) Page Start: P3063 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗