1. 3D topography evolution of micro cracks of subsurface damages during etching process. (1st January 2013) Authors: Wang, Hairong; Guan, Cheng; Zhang, Bike; Zhang, Huan; Yuan, Guoying Journal: International journal of nanomanufacturing Issue: Volume 9:Number 5/6(2013) Page Start: 446 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗