1. 3D system-in-package design using stacked silicon submount technology. Issue 2 (5th May 2015) Authors: Dong, Mingzhi; Santagata, Fabio; Sokolovskij, Robert; Wei, Jia; Yuan, Cadmus; Zhang, Guoqi Journal: Microelectronics international Issue: Volume 32:Issue 2(2015) Page Start: 63 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
2. 3D system-in-package design using stacked silicon submount technology. Issue 2 (5th May 2015) Authors: Dong, Mingzhi; Santagata, Fabio; Sokolovskij, Robert; Wei, Jia; Yuan, Cadmus; Zhang, Guoqi Journal: Microelectronics international Issue: Volume 32:Issue 2(2015) Page Start: 63 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗