1. Study on the strength of diameter-reducing solder balls by shear and pull tests. Issue 4 (2nd September 2019) Authors: Yu, Kehang; Yang, Chen; Wang, Jun; Yu, Jiabo; Yang, Yi Journal: Soldering & surface mount technology Issue: Volume 31:Issue 4(2019) Page Start: 240 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
2. Study on the strength of diameter-reducing solder balls by shear and pull tests. Issue 4 (31st May 2019) Authors: Yu, Kehang; Yang, Chen; Wang, Jun; Yu, Jiabo; Yang, Yi Journal: Soldering & surface mount technology Issue: Volume 31:Issue 4(2019) Page Start: 240 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗