1. A load identification method for the grinding damage induced stress (GDIS) distribution in silicon wafers. (August 2016) Authors: Zhou, Ping; Xu, Shance; Wang, Ziguang; Yan, Ying; Kang, Renke; Guo, Dongming Journal: International journal of machine tools & manufacture Issue: Volume 107(2016:Aug.) Page Start: 1 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗