1. Board-level vapor phase soldering (VPS) with different temperature and vacuum conditions. Issue 2 (21st February 2019) Authors: Huang, Lijuan; Zhu, Zhenghu; Wu, Hiarui; Long, Xu Journal: Multidiscipline modeling in materials and structures Issue: Volume 15:Issue 2(2019) Page Start: 353 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
2. Board-level vapor phase soldering (VPS) with different temperature and vacuum conditions. Issue 2 (23rd November 2018) Authors: Huang, Lijuan; Zhu, Zhenghu; Wu, Hiarui; Long, Xu Journal: Multidiscipline modeling in materials and structures Issue: Volume 15:Issue 2(2019) Page Start: 353 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
3. Effect of high-frequency PCB laminate on thermal cycling behavior of electronic packaging structures. Issue 1 (6th January 2022) Authors: Huang, Lijuan; Zhu, Zhenghu; Wu, Hiarui; Long, Xu Journal: Multidiscipline modeling in materials and structures Issue: Volume 18:Issue 1(2022) Page Start: 111 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗