Author/Creator: Wu, Cheng-Da - British Library Electronic Legal Deposit Catalogue-Journal Issues and Articles Search Results

Author/Creator Wu, Cheng-Da

1. Analysis of welding Au nanowires into T junctions. Issue 12 (12th August 2016)

Authors:: Wu, Cheng-Da; Fang, Te-Hua; Hsiao, Jhih-Wei
Journal:: Molecular simulation
Issue:: Volume 42:Issue 12(2016)
Page Start:: 1029
Record Type:: Journal Article
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2. Effect of temperature on welding of metallic nanowires investigated using molecular dynamics simulations. Issue 2 (22nd January 2016)

Authors:: Wu, Cheng-Da; Fang, Te-Hua; Wu, Chung-Chin
Journal:: Molecular simulation
Issue:: Volume 42:Issue 2(2016)
Page Start:: 131
Record Type:: Journal Article
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3. Effects of constituting material and interfacial crack on mechanical response of nanoscale metallic bilayers – a quasi-continuum study. Issue 15 (12th October 2020)

Authors:: Wu, Cheng-Da; Fang, Te-Hua; Su, Wen-Cheng; Fan, Yu-Cheng
Journal:: Molecular simulation
Issue:: Volume 46:Issue 15(2020)
Page Start:: 1155
Record Type:: Journal Article
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4. Effects of extrusion ratio and direction on extruded Au nanowires investigated using molecular dynamics simulation. (5th November 2021)

Authors:: Wu, Cheng-Da; Xu, Wei-Xiang
Journal:: Journal of physics communications
Issue:: Volume 5:Number 11(2021)
Page Start:
Record Type:: Journal Article
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5. Effects of tool rake angle and workpiece surface roughness on nanocutting of cu investigated using Multiscale simulation. Issue 12 (13th August 2021)

Authors:: Wu, Cheng-Da; Fang, Te-Hua; Wei, Yu-Cheng
Journal:: Molecular simulation
Issue:: Volume 47:Issue 12(2021)
Page Start:: 1010
Record Type:: Journal Article
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6. Effects of void and temperature on fracture of Cu/Cu3Sn bilayers: A molecular dynamics study. (June 2022)

Authors:: Wu, Cheng-Da; Liu, Kai-Wei
Journal:: Materials today communications
Issue:: Volume 31(2022)
Page Start:
Record Type:: Journal Article
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7. Molecular dynamics simulation of effects of microstructure and loading mode on mechanical properties of Au nanowires. Issue 16 (1st November 2020)

Authors:: Wu, Cheng-Da; Liao, Bo-Wei; Chen, Yu-Lin; Pan, Cheng-Wei; Chen, Pin-Yan; Chan, Pak-Lon; Shih, Sung-Tso
Journal:: Molecular simulation
Issue:: Volume 46:Issue 16(2020)
Page Start:: 1291
Record Type:: Journal Article
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8. Molecular dynamics simulation of strengthening of nanocrystalline Cu alloyed with Zr. (March 2021)

Authors:: Wu, Cheng-Da; Li, He-Xing
Journal:: Materials today communications
Issue:: Volume 26(2021)
Page Start:
Record Type:: Journal Article
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