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Date 2018 Author/Creator Wlanis, Thomas

1. Cu-SiO2 hybrid bonding simulation including surface roughness and viscoplastic material modeling: A critical comparison of 2D and 3D modeling approach. (July 2018)

Authors:
Wlanis, Thomas; Hammer, René; Ecker, Werner; Lhostis, Sandrine; Sart, Clément; Gallois-Garreignot, Sébastien; Rebhan, Bernhard; Maier, Günther A.
Journal:
Microelectronics and reliability
Issue:
Volume 86(2018)
Page Start:
1
Record Type:
Journal Article
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