Author/Creator: Wittler, Olaf - British Library Electronic Legal Deposit Catalogue-Journal Issues and Articles Search Results

Author/Creator Wittler, Olaf

1. Experimental and simulative study of warpage behavior for fan-out wafer-level packaging. (August 2022)

Authors:: van Dijk, Marius; Huber, Saskia; Stegmaier, Andreas; Walter, Hans; Wittler, Olaf; Schneider-Ramelow, Martin
Journal:: Microelectronics and reliability
Issue:: Volume 135(2022)
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Record Type:: Journal Article
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2. FEM-based combined degradation model of wire bond and die-attach for lifetime estimation of power electronics. (August 2020)

Authors:: Grams, Arian; Jaeschke, Johannes; Wittler, Olaf; Fabian, Benjamin; Thomas, Sven; Schneider-Ramelow, Martin
Journal:: Microelectronics and reliability
Issue:: Volume 111(2020)
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Record Type:: Journal Article
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3. Influence of temperature and humidity on power cycling capability of power modules. (November 2020)

Authors:: Wuest, Felix; Wittler, Olaf; Schneider-Ramelow, Martin
Journal:: Microelectronics and reliability
Issue:: Volume 114(2020)
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Record Type:: Journal Article
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4. Microstructural evolution of ultrasonic-bonded aluminum wires. Issue 6 (May 2015)

Authors:: Broll, Marian Sebastian; Geissler, Ute; Höfer, Jan; Schmitz, Stefan; Wittler, Olaf; Lang, Klaus Dieter
Journal:: Microelectronics and reliability
Issue:: Volume 55:Issue 6(2015)
Page Start:: 961
Record Type:: Journal Article
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