1. Investigation on the Processing Quality of Nanosecond Laser Stealth Dicing for 4H-SiC Wafer. (1st March 2023) Authors: Song, Qi; Zhang, Zhe; Xu, Ziye; Wen, Zhidong; Shi, Haiyan; Zhang, Kunpeng; Li, Man; Zhang, Zichen; Hou, Yu; Song, Zhengxun Journal: ECS journal of solid state science and technology Issue: Volume 12:Number 3(2023) Page Start: Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗