1. Electroplating of 3D Sn-rich solder for MEMS packaging applications. (28th February 2019) Authors: Wei, X L; Liu, J Q; Liu, H F; Wu, W J; Fan, J; Tu, L C Journal: Journal of micromechanics and microengineering Issue: Volume 29:Number 4(2019:Apr.) Page Start: Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
2. Erosion behavior and damage evolution of Ti-6Al-4V aero-engine titanium alloy. Issue 1 (February 2020) Authors: Li, Y Q; Wang, X D; Long, C B; Sun, Z P; Wei, X L; Zhou, L C Journal: IOP conference series Issue: Volume 770:Issue 1(2020) Page Start: Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗