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Author/Creator Ueshima, Minoru

1. Development of crack-less and deformation-resistant electroplated Ni/electroless Ni/Pt/Ag metallization layers for Ag-sintered joint during a harsh thermal shock. (December 2022)

Authors:
Liu, Yang; Chen, Chuantong; Zhang, Zheng; Ueshima, Minoru; Sakamoto, Takeshi; Naoe, Takuya; Nishikawa, Hiroshi; Oda, Yukinori; Suganuma, Katsuaki
Journal:
Materials & design
Issue:
Volume 224(2022)
Page Start:
Record Type:
Journal Article
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3. Self-catalyzed copper–silver complex inks for low-cost fabrication of highly oxidation-resistant and conductive copper–silver hybrid tracks at a low temperature below 100 °C. Issue 11 (2nd March 2018)

Authors:
Li, Wanli; Li, Cai-Fu; Lang, Fengpei; Jiu, Jinting; Ueshima, Minoru; Wang, Hao; Liu, Zhi-Quan; Suganuma, Katsuaki
Journal:
Nanoscale
Issue:
Volume 10:Issue 11(2018)
Page Start:
5254
Record Type:
Journal Article
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