1. A comparison between complete and incomplete cellular precipitations. (15th March 2018) Authors: Tu, K.N.; Gusak, A.M. Journal: Scripta materialia Issue: Number 146(2018) Page Start: 133 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
2. A metastable phase of tin in 3D integrated circuit solder microbumps. (June 2015) Authors: Liu, Yingxia; Tamura, Nobumichi; Kim, Dong Wook; Gu, Sam; Tu, K.N. Journal: Scripta materialia Issue: Volume 102(2015) Page Start: 39 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
3. Extremely rapid grain growth in scallop-type Cu6Sn5 during solid–liquid interdiffusion reactions in micro-bump solder joints. (1st April 2020) Authors: Gusak, A.M.; Tu, K.N.; Chen, Chih Journal: Scripta materialia Issue: Number 179(2020) Page Start: 45 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
4. Fracture reliability concern of (Au, Ni)Sn4 phase in 3D integrated circuit microbumps using Ni/Au surface finishing. (1st July 2016) Authors: Liu, Yingxia; Chen, Yi-Ting; Gu, Sam; Kim, Dong-Wook; Tu, K.N. Journal: Scripta materialia Issue: Volume 119(2016) Page Start: 9 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
5. Fracture reliability concern of (Au, Ni)Sn4 phase in 3D integrated circuit microbumps using Ni/Au surface finishing. (1st July 2016) Authors: Liu, Yingxia; Chen, Yi-Ting; Gu, Sam; Kim, Dong-Wook; Tu, K.N. Journal: Scripta materialia Issue: Volume 119(2016) Page Start: 9 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
6. Growth competition between layer-type and porous-type Cu3Sn in microbumps. (December 2017) Authors: Chu, David T.; Chu, Yi-Cheng; Lin, Jie-An; Chen, Yi-Ting; Wang, Chun-Chieh; Song, Yen-Fang; Chiang, Cheng-Cheng; Chen, Chih; Tu, K.N. Journal: Microelectronics and reliability Issue: Volume 79(2017) Page Start: 32 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
7. Scaling effect of interfacial reaction on intermetallic compound formation in Sn/Cu pillar down to 1 μm diameter. (15th September 2016) Authors: Liu, Yingxia; Chu, Ying-Ching; Tu, K.N. Journal: Acta materialia Issue: Volume 117(2016) Page Start: 146 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
8. Scaling effect of interfacial reaction on intermetallic compound formation in Sn/Cu pillar down to 1 μm diameter. (15th September 2016) Authors: Liu, Yingxia; Chu, Ying-Ching; Tu, K.N. Journal: Acta materialia Issue: Volume 117(2016) Page Start: 146 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
9. Surface protrusion induced by inter-diffusion on Cu-Sn micro-pillars. (December 2022) Authors: Chen, Yang; Dai, Wenjie; Liu, Yingxia; Chen, Chih; Tu, K.N.; Chen, Guang Journal: Materials & design Issue: Volume 224(2022) Page Start: Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
10. Thermomigration induced microstructure and property changes in Sn-58Bi solders. (15th March 2019) Authors: Shen, Yu-An; Zhou, Shiqi; Li, Jiahui; Tu, K.N.; Nishikawa, Hiroshi Journal: Materials & design Issue: Volume 166(2019) Page Start: Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗