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1. A new strategy for the preparation of silver/epoxy/poly(vinylidene fluoride) dielectric composites with a multi‐interface structure for suppressed dielectric loss. (15th April 2018)

5. Thermal‐induced dielectric response in mechanically durable polyvinylidene fluoride–kapok encapsulated polyethylene glycol composite films. Issue 6 (9th April 2022)