1. HRXRD and micro-CT multiscale investigation of stress and defects induced by a novel packaging design for MEMS sensors. (December 2022) Authors: Borzì, Aurelio; Zboray, Robert; Dolabella, Simone; Brun, Sébastien; Telmont, Florian; Kupferschmied, Peter; Néal, Jean-François Le; Drljaca, Pedrag; Fiorucci, Gianni; Dommann, Alex; Neels, Antonia Journal: Applied materials today Issue: Volume 29(2022) Page Start: Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗