1. Impact of SiO2 on Al–Al thermocompression wafer bonding. (13th February 2015) Authors: Malik, Nishant; Schjølberg-Henriksen, Kari; Poppe, Erik U; Taklo, Maaike M V; Finstad, Terje G Journal: Journal of micromechanics and microengineering Issue: Volume 25:Number 3(2015:Mar.) Page Start: Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗