1. Sn-Cu intermetallic compound laminated film with excellent friction coefficient, contact resistance, and solder wettability. (2nd January 2022) Authors: Hayashi, Hiroki; Takaine, Naohiro; Funasaki, Hiroyuki; Watanabe, Mitsuhiro Journal: Transactions of the Institute of Metal Finishing Issue: Volume 100:Number 1(2022) Page Start: 43 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗