1. Electrodeposition and growth mechanism of preferentially orientated nanotwinned Cu on silicon wafer substrate. Issue 10 (October 2018) Authors: Sun, Fu-Long; Gao, Li-Yin; Liu, Zhi-Quan; Zhang, Hao; Sugahara, Tohru; Nagao, Shijo; Suganuma, Katsuaki Journal: Journal of materials science & technology Issue: Volume 34:Issue 10(2018) Page Start: 1885 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗