1. Effect of elevated temperature on PCB responses and solder interconnect reliability under vibration loading. Issue 11 (November 2015) Authors: Zhang, H.W.; Liu, Y.; Wang, J.; Sun, F.L. Journal: Microelectronics and reliability Issue: Volume 55:Issue 11(2015) Page Start: 2391 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
2. Isogeometric boundary element method for crack propagation based on Bézier extraction of NURBS. (February 2019) Authors: Sun, F.L.; Dong, C.Y.; Yang, H.S. Journal: Engineering analysis with boundary elements Issue: Volume 99(2019) Page Start: 76 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
3. The Effect on Carburizing Process on Microstructure and Properties of 20MnCr5 Gear Steel. Issue 2 (April 2021) Authors: Liang, X.; Li, X.J.; Lin, X.Y.; Fan, Z.Y.; Luo, P.; Sun, F.L.; Gao, B.K.; Zhou, T.; Du, Q.N.; Xie, H.S. Journal: Journal of physics Issue: Volume 1885:Issue 2(2021) Page Start: Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
4. Three-dimensional crack propagation and inclusion-crack interaction based on IGABEM. (1st October 2021) Authors: Sun, F.L.; Dong, C.Y. Journal: Engineering analysis with boundary elements Issue: Volume 131(2021) Page Start: 1 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗