1. Unique Microstructures and High Thermoelectric Performance in n–type Bi2Te2.7Se0.3 by the Dual Incorporation of Cu and Y. (February 2023) Authors: Lee, Hyungseok; Kim, Taeshik; Son, Seong Chan; Kim, Jongchan; Kim, Dawoon; Lee, Jieun; Chung, In Journal: Materials today physics Issue: Volume 31(2023) Page Start: Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗