Author/Creator: Sohn, Yoonchul / Journal: Microelectronics and reliability - British Library Electronic Legal Deposit Catalogue-Journal Issues and Articles Search Results

Author/Creator Sohn, Yoonchul Journal Microelectronics and reliability

1. Effective (Pd, Ni)Sn4 diffusion barrier to suppress brittle fracture at Sn-58Bi-xAg solder joint with Ni(P)/Pd(P)/Au metallization pad. (February 2022)

Authors:: Kim, Jungsoo; Park, Dae-Young; Ahn, Byeongjin; Bang, Junghwan; Kim, Min-Su; Park, Hyun-Soon; Sohn, Yoonchul; Ko, Yong-Ho
Journal:: Microelectronics and reliability
Issue:: Volume 129(2022)
Page Start:
Record Type:: Journal Article
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2. Effects of Ag addition and Ag3Sn formation on the mechanical reliability of Ni/Sn solder joints. (August 2017)

Authors:: Chu, Kunmo; Lee, Changseung; Park, Sung-Hoon; Sohn, Yoonchul
Journal:: Microelectronics and reliability
Issue:: Volume 75(2017)
Page Start:: 53
Record Type:: Journal Article
View Content:: Available online (eLD content is only available in our Reading Rooms) ↗