1. Convection vs vapour phase reflow in LED and BGA assembly. Issue 2 (27th February 2018) Authors: Dziurdzia, Barbara; Sobolewski, Maciej; Mikolajek, Janusz Journal: Soldering & surface mount technology Issue: Volume 30:Issue 2(2018) Page Start: 87 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
2. Convection vs vapour phase reflow in LED and BGA assembly. Issue 2 (3rd April 2018) Authors: Dziurdzia, Barbara; Sobolewski, Maciej; Mikolajek, Janusz Journal: Soldering & surface mount technology Issue: Volume 30:Issue 2(2018) Page Start: 87 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
3. Estimating demand for fixed-line telecommunication bundles. Issue 4 (May 2017) Authors: Sobolewski, Maciej; Kopczewski, Tomasz Journal: Telecommunications policy Issue: Volume 41:Issue 4(2017) Page Start: 227 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
4. Experimental approach to thermal conductivity of macro solder joints with voids. Issue 3 (12th June 2019) Authors: Sobolewski, Maciej; Dziurdzia, Barbara Journal: Soldering & surface mount technology Issue: Volume 31:Issue 3(2019) Page Start: 181 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
5. How much do switching costs and local network effects contribute to consumer lock-in in mobile telephony?. Issue 9 (September 2016) Authors: Czajkowski, Mikołaj; Sobolewski, Maciej Journal: Telecommunications policy Issue: Volume 40:Issue 9(2016) Page Start: 855 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
6. Low-voiding solder pastes in LED assembly. Issue 4 (12th May 2020) Authors: Dziurdzia, Barbara; Sobolewski, Maciej; Mikołajek, Janusz; Wroński, Sebastian Journal: Soldering & surface mount technology Issue: Volume 32:Issue 4(2020) Page Start: 201 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
7. Low-voiding solder pastes in LED assembly. Issue 4 (1st May 2020) Authors: Dziurdzia, Barbara; Sobolewski, Maciej; Mikołajek, Janusz; Wroński, Sebastian Journal: Soldering & surface mount technology Issue: Volume 32:Issue 4(2020) Page Start: 201 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
8. Measuring network effects in mobile telecommunications markets with stated-preference valuation methods. (1st January 2011) Authors: Czajkowski, Mikołaj; Sobolewski, Maciej Journal: International journal of management and network economics Issue: Volume 2:Number 2(2011) Page Start: 197 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
9. Measuring network effects in mobile telecommunications markets with stated-preference valuation methods. (26th October 2011) Authors: Czajkowski, Mikołaj; Sobolewski, Maciej Journal: International journal of management and network economics Issue: Volume 2:Number 2(2011) Page Start: 197 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
10. Solder joints reliability of through hole assemblies with various land and hole design. (October 2021) Authors: Sobolewski, Maciej; Wojewoda-Budka, Joanna; Huber, Zbigniew; Zieba, Pawel; Wierzbicka-Miernik, Anna Journal: Microelectronics and reliability Issue: Volume 125(2021) Page Start: Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗