1. Complementary EIS/FTIR study of the degradation of adhesives in electronic packaging. Issue 11 (8th June 2020) Authors: Schneider, Michael; Gierth, Uta; Simunkova, Lenka; Gierth, Paul; Rebenklau, Lars Journal: Materials and corrosion Issue: Volume 71:Issue 11(2020) Page Start: 1832 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗