1. Integrated circuit (IC)‐embedded wafer‐level packaging technology for millimeter‐wave power ICs. Issue 9 (4th June 2019) Authors: Yook, Jong‐Min; Sim, Sanghoon; Park, Bok‐Ju; Kim, Dongsu; Kim, Young‐Joon Journal: Microwave and optical technology letters Issue: Volume 61:Issue 9(2019:Sep.) Page Start: 2210 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗