Author/Creator: Sethu, Raj Sekar - British Library Electronic Legal Deposit Catalogue-Journal Issues and Articles Search Results

Author/Creator Sethu, Raj Sekar

1. A computational study of the effect of bond pad thickness on the polysilicon piezoresistivity due to wafer level probing. (September 2019)

Authors:: Mane, Sanjay Shrirang; Sethu, Raj Sekar; Bergmann, Lars; Erstling, Marco; Soon, Kok Heng
Journal:: Microelectronics and reliability
Issue:: Volume 100/101(2019)
Page Start:
Record Type:: Journal Article
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2. Characterization of copper precipitates on aluminum copper bond pads formed after plasma clean and de-ionized water exposure. Issue 7 (June 2015)

Authors:: Sethu, Raj Sekar; Ng, Hong Seng; Chan, Alvin; Ong, Cheng Nee; Chan, Sieng Fong
Journal:: Microelectronics and reliability
Issue:: Volume 55:Issue 7(2015)
Page Start:: 1101
Record Type:: Journal Article
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3. Reliability evaluation of tungsten donut-via as an element of the highly robust metallization. (September 2016)

Authors:: Hein, Verena; Erstling, Marco; Sethu, Raj Sekar; Weide-Zaage, Kirsten; Bai, Tianlin
Journal:: Microelectronics and reliability
Issue:: Volume 64(2016)
Page Start:: 259
Record Type:: Journal Article
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4. Reliability evaluation of tungsten donut-via as an element of the highly robust metallization. (September 2016)

Authors:: Hein, Verena; Erstling, Marco; Sethu, Raj Sekar; Weide-Zaage, Kirsten; Bai, Tianlin
Journal:: Microelectronics and reliability
Issue:: Volume 64(2016)
Page Start:: 259
Record Type:: Journal Article
View Content:: Available online (eLD content is only available in our Reading Rooms) ↗