Author/Creator: Schrank, F. - British Library Electronic Legal Deposit Catalogue-Journal Issues and Articles Search Results

Author/Creator Schrank, F.

1. Automatized failure analysis of tungsten coated TSVs via scanning acoustic microscopy. (September 2016)

Authors:: Grünwald, E.; Rosc, J.; Hammer, R.; Czurratis, P.; Koch, M.; Kraft, J.; Schrank, F.; Brunner, R.
Journal:: Microelectronics and reliability
Issue:: Volume 64(2016)
Page Start:: 370
Record Type:: Journal Article
View Content:: Available online (eLD content is only available in our Reading Rooms) ↗

2. Automatized failure analysis of tungsten coated TSVs via scanning acoustic microscopy. (September 2016)

Authors:: Grünwald, E.; Rosc, J.; Hammer, R.; Czurratis, P.; Koch, M.; Kraft, J.; Schrank, F.; Brunner, R.
Journal:: Microelectronics and reliability
Issue:: Volume 64(2016)
Page Start:: 370
Record Type:: Journal Article
View Content:: Available online (eLD content is only available in our Reading Rooms) ↗

3. Parameter driven monitoring for a flip-chip LED module under power cycling condition. (March 2018)

Authors:: Magnien, J.; Mitterhuber, L.; Rosc, J.; Schrank, F.; Hörth, S.; Hutter, M.; Defregger, S.; Kraker, E.
Journal:: Microelectronics and reliability
Issue:: Volume 82(2018)
Page Start:: 84
Record Type:: Journal Article
View Content:: Available online (eLD content is only available in our Reading Rooms) ↗

4. Reliability and failure analysis of solder joints in flip chip LEDs via thermal impedance characterisation. (September 2017)

Authors:: Magnien, J.; Mitterhuber, L.; Rosc, J.; Schrank, F.; Hörth, S.; Goullon, L.; Hutter, M.; Defregger, S.; Kraker, E.
Journal:: Microelectronics and reliability
Issue:: Volume 76/77(2017)
Page Start:: 601
Record Type:: Journal Article
View Content:: Available online (eLD content is only available in our Reading Rooms) ↗